FILM ADHESIVE

摘要

Curable compositions are provided which comprise: a) 30-80 wt% of a room temperature liquid epoxy resin; b) 0.5-10 wt% of an epoxy curative; c) 5-40 wt% of a thermoplastic resin; and d) 0.5-10 wt% of a physical blowing agent. In some embodiments, the curable compositions may be fire retardant. In some embodiments, the curable compositions may be used in the form of films, and more particularly as core splice film adhesives.