发明名称 |
LASER BEAM MACHINING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of achieving space-saving, high-speed, and high-quality laser beam machining using simultaneous multiple radiation.SOLUTION: A laser beam machining device comprises: a laser oscillator 3a serving as first laser oscillation means for outputting a first laser beam; a laser oscillator 3b serving as second laser oscillation means for outputting a second laser beam; a sub-galvanometer scanner 7a serving as a first sub-galvanometer scanner; a sub-galvanometer scanner 7b serving as a second sub-galvanometer scanner; a polarization beam splitter 8 serving as laser mixture means; main galvanometer scanners 9a and 9b; an F&thetas; lens 10 for condensing the first laser beam and the second laser beam from the main galvanometer scanners 9a and 9b; and a laser oscillator controller 22 serving as laser oscillation control means for individually controlling the first laser oscillation means and the second laser oscillation means.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016026881(A) |
申请公布日期 |
2016.02.18 |
申请号 |
JP20150068787 |
申请日期 |
2015.03.30 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
TAKAHASHI YOSHIFUMI;ISHIZUKA TOMOHIKO;ITO KENJI;NARUSE MASASHI;KANEDA MITSUHIRO |
分类号 |
B23K26/082;B23K26/00;B23K26/03;B23K26/064;B23K26/067;B23K26/382 |
主分类号 |
B23K26/082 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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