发明名称 LASER BEAM MACHINING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of achieving space-saving, high-speed, and high-quality laser beam machining using simultaneous multiple radiation.SOLUTION: A laser beam machining device comprises: a laser oscillator 3a serving as first laser oscillation means for outputting a first laser beam; a laser oscillator 3b serving as second laser oscillation means for outputting a second laser beam; a sub-galvanometer scanner 7a serving as a first sub-galvanometer scanner; a sub-galvanometer scanner 7b serving as a second sub-galvanometer scanner; a polarization beam splitter 8 serving as laser mixture means; main galvanometer scanners 9a and 9b; an F&thetas; lens 10 for condensing the first laser beam and the second laser beam from the main galvanometer scanners 9a and 9b; and a laser oscillator controller 22 serving as laser oscillation control means for individually controlling the first laser oscillation means and the second laser oscillation means.SELECTED DRAWING: Figure 1
申请公布号 JP2016026881(A) 申请公布日期 2016.02.18
申请号 JP20150068787 申请日期 2015.03.30
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAHASHI YOSHIFUMI;ISHIZUKA TOMOHIKO;ITO KENJI;NARUSE MASASHI;KANEDA MITSUHIRO
分类号 B23K26/082;B23K26/00;B23K26/03;B23K26/064;B23K26/067;B23K26/382 主分类号 B23K26/082
代理机构 代理人
主权项
地址