发明名称 HIGH TEMPERATURE ATOMIC LAYER DEPOSITION OF SILICON OXIDE THIN FILMS
摘要 PROBLEM TO BE SOLVED: To provide atomic layer deposition process formation for silicon oxide at temperature above 500°C.SOLUTION: A silicon precursor used has formula RRSi(NRR)X(R, Rand Rare each hydrogen, a linear or branched C-Calkyl group, or a C-Caryl group; Ris a linear or branched C-Calkyl group, a C-Caryl group, or a C-Calkylsilyl group; Rand Rare linked or not linked; X is Cl, Br or I; m is 0-3; n is 0-2; p is 0-2; and m+n+p=3), or RRSi(OR)(OR)X(Rand Rare each hydrogen, a linear or branched C-Calkyl group, or a C-Caryl group; Rand Rare each a linear or branched C-Calkyl group or a C-Caryl group; Rand Rare linked or not linked; X is Cl; Br or I; m is 0-3; n is 0-2; q is 0-2; p is 0-2; and m+n+q+p=3).SELECTED DRAWING: Figure 1
申请公布号 JP2016027674(A) 申请公布日期 2016.02.18
申请号 JP20150210441 申请日期 2015.10.27
申请人 AIR PRODUCTS AND CHEMICALS INC 发明人 HAIRPIN CHANDRA;WANG MEILIANG;XIAO MANCHAO;LEI XINJIAN;PEARLSTEIN RONALD MARTIN;MARC O'NEAL LEONARD;HAN BING
分类号 H01L21/316;C23C16/42;C23C16/455 主分类号 H01L21/316
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