| 摘要 |
PROBLEM TO BE SOLVED: To provide an ablation processing method which enables the suppression of the spread of energy and the reflection of a laser beam.SOLUTION: An ablation processing method for performing an ablation processing by applying a laser beam to a wafer in which devices are respectively formed on surface regions segmented by streets formed as if making a grid-like form, and a metal test element group is formed on at least part of the streets comprises: a protection film formation step of coating a surface of the wafer with a liquid resin having metal oxide powder capable of absorbing a wavelength of the laser beam mixed therein, thereby forming a protection film with the metal oxide powder included therein; and a laser processing step of applying the laser beam to the streets, thereby forming process grooves by ablation processing and in parallel, removing the test element group after the protection film formation step.SELECTED DRAWING: Figure 8 |
