VERTICAL SOLID-STATE TRANSDUCERS HAVING BACKSIDE TERMINALS AND ASSOCIATED SYSTEMS AND METHODS

摘要

Vertical solid-state transducers (“SSTs”) having backside contacts are disclosed herein. An SST in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the SST, a second semiconductor material at a second side of the SST opposite the first side, and an active region between the first and second semiconductor materials. The SST can further include first and second contacts electrically coupled to the first and second semiconductor materials, respectively. A portion of the first contact can be covered by a dielectric material, and a portion can remain exposed through the dielectric material. A conductive carrier substrate can be disposed on the dielectric material. An isolating via can extend through the conductive carrier substrate to the dielectric material and surround the exposed portion of the first contact to define first and second terminals electrically accessible from the first side.

主权项

1. A method of forming solid-state transducers (SSTs) having a first side and a second side, the method comprising:
forming a transducer structure having an active region positioned between a first semiconductor material and a second semiconductor material, wherein the first semiconductor material is at the first side of the SST and the second semiconductor material is at the second side of the SST; forming a first contact on the first side of the SST; forming a second contact on the first side of the SST, wherein the second contact includes a plurality of interconnected buried contact elements electrically coupled to the second semiconductor material; forming a dielectric material on the first side of the SST leaving a portion of the first contact and a portion of the second contact exposed through the dielectric material; disposing a conductive carrier substrate on the dielectric material, wherein the conductive carrier substrate is electrically coupled to the first and second contacts; and electrically isolating the first contact from the second contact, wherein a portion of the conductive carrier substrate defines a first terminal electrically coupled to the first contact and a portion of the conductive carrier substrate defines a second terminal electrically coupled to the second contact, and wherein the first and second electrical terminals are both exposed at the first side of the SST.