| 发明名称 |
POLYIMIDE COVER SUBSTRATE |
| 摘要 |
Disclosed is a polyimide cover substrate, which has a thickness of a predetermined level or more to implement processes, and can prevent generation of usual scratches in a flexible electronic device and can protect a substructure, and also has conductivity to thus provide a touch-integrated transparent polyimide cover substrate which enables screen touch. |
| 申请公布号 |
US2016046103(A1) |
申请公布日期 |
2016.02.18 |
| 申请号 |
US201414782419 |
申请日期 |
2014.04.10 |
| 申请人 |
KOLON INDUSTRIES, INC. |
发明人 |
HONG Ki ll;JUNG Hak Gee |
| 分类号 |
B32B27/08;B32B27/28;B32B27/36;B32B7/12 |
主分类号 |
B32B27/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polyimide cover substrate, comprising:
a first base layer, comprising a support film and a conductive coating layer formed on at least one surface of the support film; a second base layer, comprising a polyimide film and a hard coating layer formed on at least one surface of the polyimide film; and an adhesive layer formed between the first base layer and the second base layer. |
| 地址 |
Gwacheon-si, Gyeonggi-do KR |
