| 摘要 |
This semiconductor device has a laminated substrate having a circuit board, a semiconductor chip fixed to the circuit board, a tubular leading end portion, and a wiring section in a shape other than a tubular shape, and is provided with a terminal in which the leading end portion and the wiring section are formed from one conductive member and a jointing material that electrically and mechanically couples the circuit board and the leading end portion. |
