发明名称 RADICAL CURABLE COMPOSITION FOR WAFER LEVEL LENS
摘要 PROBLEM TO BE SOLVED: To provide a radical curable composition for a wafer level lens allowing for forming a cured material excellent in optical properties and exhibiting quite superior shape holding properties even in a high temperature environment.SOLUTION: A radical curable composition for a wafer level lens of the present invention comprises, as radical curable compounds, a radical curable compound (A) represented by the following Formula (1) and a radical curable compound (B) represented by a fluorene-group-containing diacrylate, a viscosity at 25°C being not more than 3600 mPa s. (In Formula (1), R1 indicates a single bond, a methylene group, a sulfonyl group, a sulfur atom, or an oxygen atom, and R2, R3 are identical or different and indicate hydrogen atoms or methyl groups. X, X' are identical or different and indicate sulfur atoms or oxygen atoms. R, R' are identical or different and indicate alkyl groups having a carbon number of 1 to 5, and n, n' are identical or different and indicate 0 or 1.)SELECTED DRAWING: None
申请公布号 JP2016027403(A) 申请公布日期 2016.02.18
申请号 JP20150160501 申请日期 2015.08.17
申请人 DAICEL CORP 发明人 KUBO TAKASHI;FUJIKAWA TAKESHI;KISHIMOTO MAKI
分类号 G02B1/04;C08F20/20 主分类号 G02B1/04
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