PHASE CHANGING ON-CHIP THERMAL HEAT SINK

摘要

A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the device. The method further includes forming a heat sink in at least one of the plurality of insulator layers and proximate to the device. The heat sink includes a reservoir of phase change material having a melting point temperature that is less than an upper limit of a design operating temperature of the chip.

主权项

1. A semiconductor structure, comprising:
a device on a substrate of an integrated circuit chip; a heat sink proximate to the device; a liner encapsulating the core; and an external heat sink thermally connected to the heat sink, wherein the heat sink comprises a core composed of a phase change material having a melting point temperature that is less than an upper limit of a design operating temperature of the chip.