发明名称 THERMALLY CONDUCTIVE SHEET, CURED PRODUCT OF THERMALLY CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thermally conductive sheet and a cured product of the sheet which exhibit excellent balance between thermal radiation property and insulating property, and a semiconductor device having high durability.SOLUTION: A thermally conductive sheet according to the present invention includes a thermosetting resin (A) and an inorganic filler (B) dispersed in the thermosetting resin (A). In measurement of pore diameter distribution by a mercury intrusion method for the inorganic filler (B) included in an incineration residue after a cured product of the thermally conductive sheet is heated and incinerated at 700°C for 4 hours, a porosity of the inorganic filler represented by 100×b/a is between at least 40% and 65% or less, where a represents the volume of particles of the inorganic filler included in the incineration residue, and b represents the volume of voids in the particles of the inorganic filler included in the incineration residue measured by the mercury intrusion method. An average pore diameter of the inorganic filler included in the incineration residue measured by the mercury intrusion method is between at least 0.20 μm and 1.35 μm or less.SELECTED DRAWING: None
申请公布号 JP2016027142(A) 申请公布日期 2016.02.18
申请号 JP20150130019 申请日期 2015.06.29
申请人 SUMITOMO BAKELITE CO LTD 发明人 MOCHIZUKI SHUNSUKE;KITAGAWA KAZUYA;SHIRATO HIROTSUGU;NAGAHASHI KEITA;TSUDA MIKA;HIRASAWA NORIYA;KUROKAWA MOTOMI
分类号 C08J5/18;H01L23/36;H01L23/373 主分类号 C08J5/18
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