HEAT DISSIPATING ASSEMBLY

摘要

A heat dissipating assembly includes a substrate configured to support at least one heat producing component and a thermally conductive cooling fin extending from the substrate, wherein heat is conducted away from the heat producing component.

主权项

1. A heat dissipating assembly, comprising:
a substrate configured to support at least one heat producing component; a thermally conductive cooling fin extending from the substrate; and a thermally conductive heat pipe conductively coupled to the heat producing component, extending within at least a portion of the cooling fin, and defining a fluid reservoir containing a phase change fluid; wherein the phase change fluid changes between a liquid and a gas in response to heat conducted from the heat producing component to the heat pipe.