发明名称 Module with Integrated Power Electronic Circuitry and Logic Circuitry
摘要 A integrated power module with integrated power electronic circuitry and logic circuitry includes an embedded power semiconductor module including one or more power semiconductor dies embedded in a dielectric material, a multi-layer logic printed circuit board with one or more logic dies mounted to a surface of the logic printed circuit board, and a flexible connection integrally formed between the embedded power semiconductor module and the logic printed circuit board. The flexible connection mechanically connects the embedded power semiconductor module to the logic printed circuit board and provides an electrical pathway between the embedded power semiconductor module and the logic printed circuit board. A method of manufacturing the integrated power module is also provided.
申请公布号 US2016050768(A1) 申请公布日期 2016.02.18
申请号 US201414457663 申请日期 2014.08.12
申请人 Infineon Technologies AG 发明人 Chen Liu;Dinkel Markus;Salminen Toni
分类号 H05K3/40;H05K3/00;H05K7/06 主分类号 H05K3/40
代理机构 代理人
主权项 1. A method of interconnecting power electronic circuitry with logic circuitry, the method comprising: providing a multi-layer logic printed circuit board and an embedded power semiconductor module, the embedded power semiconductor module including one or more power semiconductor dies embedded in a dielectric material; mounting one or more logic dies to a surface of the logic printed circuit board; and forming an integral flexible connection between the embedded power semiconductor module and the logic printed circuit board, the integral flexible connection mechanically connecting the embedded power semiconductor module to the logic printed circuit board and providing an electrical pathway between the embedded power semiconductor module and the logic printed circuit board.
地址 Neubiberg DE