SEMICONDUCTOR DEVICE AND HEAT-DISSIPATING MECHANISM

摘要

A semiconductor device includes a semiconductor chip which can be a heat-generating semiconductor chip or a semiconductor relay substrate in which an integrated circuit or wiring is built in. A sintered-silver-coated film is adhered on a surface layer part of the semiconductor substrate, interposed by a silicon oxide film. A heat-dissipating fin (heat sink), which may be copper or aluminum, is bonded on the sintered-silver-coated film, interposed by an adhesive layer.

主权项

1. A semiconductor device comprising:
a heat-generating semiconductor substrate incorporated with an integrated circuit or wirings; a silver thin film manufactured from nano-silver particles and formed by a coating method in a closely adhering manner on one surface of the semiconductor substrate; and a silicon oxidation film having a film thickness of 1 nm or more formed at an adhesion interface between the semiconductor substrate and the silver thin film.