| 发明名称 |
WAFER CARRIER |
| 摘要 |
A wafer carrier comprises a body part constructed and arranged to accommodate a wafer and including first and second layers which are stacked in sequence. A cover is mountable to the body part. A first air filter is positioned on the cover. A second air filter is positioned on a side of the body part. The second layer is positioned between the first layer and an inner region of the body part. A surface of the second layer facing the inner region is subjected to charge prevention processing. |
| 申请公布号 |
US2016049320(A1) |
申请公布日期 |
2016.02.18 |
| 申请号 |
US201514635147 |
申请日期 |
2015.03.02 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
Choo Yeon-sik;Park Soo-Jae;Noh Jae-Heon;Cho Yong-Sang |
| 分类号 |
H01L21/673 |
主分类号 |
H01L21/673 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wafer carrier comprising:
a body part constructed and arranged to accommodate a wafer and including first and second layers which are stacked in sequence; a cover mountable to the body part; a first air filter positioned on the cover; and a second air filter positioned on a side of the body part, wherein the second layer is positioned between the first layer and an inner region of the body part and wherein a surface of the second layer facing the inner region is subjected to charge prevention processing. |
| 地址 |
Suwon-si KR |
