| 摘要 |
This mounting device, which mounts an electronic component onto a substrate, is provided with the following: a mounting tool 14 that holds the electronic component on the tip surface thereof, namely a holding surface 14a; a movement mechanism that moves the mounting tool 14 relative to the substrate; an angle-detecting mechanism that measures the slope of a plate-shaped measuring jig 64 held on the aforementioned holding surface 14a; and a control unit that controls the driving of the mounting device. To inspect the holding surface 14a, the control unit makes the mounting tool 14 hold the measuring jig 64 and makes the angle-detecting mechanism measure the slope of said measuring jig 64. A mounting device in which the state of the holding surface of a mounting tool can be measured more accurately is thus provided. |
