发明名称 |
WIRE BONDS FOR ELECTRONICS |
摘要 |
A circuit element includes a semiconductor chip and a wire for connecting between the semiconductor chip and an additional circuit element. A plurality of wire bond connections electrically connect the wire and the semiconductor chip. The plurality of wire bond connections can be disposed on a surface of the semiconductor chip and on a surface of the wire. |
申请公布号 |
US2016049380(A1) |
申请公布日期 |
2016.02.18 |
申请号 |
US201414459011 |
申请日期 |
2014.08.13 |
申请人 |
Hamilton Sundstrand Corporation |
发明人 |
Chen Yan;Burlatsky Sergei F.;Gorbounov Mikhail B. |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A circuit element, comprising:
a semiconductor chip; a wire for connecting between the semiconductor chip and an additional circuit element; and a plurality of wire bond connections electrically connecting the wire and the semiconductor chip. |
地址 |
Charlotte NC US |