发明名称 WIRE BONDS FOR ELECTRONICS
摘要 A circuit element includes a semiconductor chip and a wire for connecting between the semiconductor chip and an additional circuit element. A plurality of wire bond connections electrically connect the wire and the semiconductor chip. The plurality of wire bond connections can be disposed on a surface of the semiconductor chip and on a surface of the wire.
申请公布号 US2016049380(A1) 申请公布日期 2016.02.18
申请号 US201414459011 申请日期 2014.08.13
申请人 Hamilton Sundstrand Corporation 发明人 Chen Yan;Burlatsky Sergei F.;Gorbounov Mikhail B.
分类号 H01L23/00 主分类号 H01L23/00
代理机构 代理人
主权项 1. A circuit element, comprising: a semiconductor chip; a wire for connecting between the semiconductor chip and an additional circuit element; and a plurality of wire bond connections electrically connecting the wire and the semiconductor chip.
地址 Charlotte NC US