| 发明名称 |
SEMICONDUCTOR BAKING APPARATUS AND OPERATION METHOD THEREOF |
| 摘要 |
A semiconductor baking apparatus includes a load lock chamber, a process chamber, a transfer chamber, a first interior door, and a controller. The process chamber has a first accommodating space therein. The transfer chamber has a second accommodating space therein, and the transfer chamber is connected to the load lock chamber and the process chamber. The first interior door is between the process chamber and the transfer chamber. When the first interior door is opened, the first accommodating space is communicated with the second accommodating space. The controller is programmed to open the first interior door when the semiconductor baking apparatus idles. |
| 申请公布号 |
US2016049321(A1) |
申请公布日期 |
2016.02.18 |
| 申请号 |
US201414461035 |
申请日期 |
2014.08.15 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHEN Hsin-Kai;WANG Hung-Chih;HUANG Hon-Lin;LIN Shih-Chi |
| 分类号 |
H01L21/677;H01L21/67 |
主分类号 |
H01L21/677 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor baking apparatus comprising:
a load lock chamber; a process chamber having a first accommodating space therein; a transfer chamber having a second accommodating space therein and connected to the load lock chamber and the process chamber; a first interior door between the process chamber and the transfer chamber, wherein when the first interior door is opened, the first accommodating space is communicated with the second accommodating space; and a controller programmed to open the first interior door when the semiconductor baking apparatus idles. |
| 地址 |
HSINCHU TW |
