发明名称 |
SINGLE CELL CAPTURE WITH CAPTURE CHIPS |
摘要 |
The present invention provides methods, systems, assemblies, and articles for capturing single cells with a capture chip. In certain embodiments, the capture chip comprises a substrate comprising a plurality of cell-sized dimples or wells that each allow a single cell to be captured from a cell suspension. In some embodiments, the dimples or wells of the capture chip align with the holes or wells of a multi-well through-hole chip, and/or a multi-well chip, such that the cell, or the contents of the single cell, may be transferred to a corresponding well of the multi-well chip. In particular embodiments, the bottom of each dimple or well of the capture chip has a positive electrical charge sufficient to attract cells from a cell suspension flowing over the dimples or wells. |
申请公布号 |
US2016045884(A1) |
申请公布日期 |
2016.02.18 |
申请号 |
US201514925654 |
申请日期 |
2015.10.28 |
申请人 |
WaferGen, Inc. |
发明人 |
Husain Syed A.;Griswold Bradley L.;Slater Michael;Espinoza Patricio;Dunne Jude;Hein Glenn;Srinivasan Maithreyan |
分类号 |
B01J19/00 |
主分类号 |
B01J19/00 |
代理机构 |
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代理人 |
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主权项 |
1. A system comprising:
a) a capture chip comprising a substrate comprising a plurality of cell-sized dimples or wells that each allow a single cell to be captured from a cell mixture; and b) a multi-well through-hole chip, wherein said multi-well through-hole chip comprises a plurality of holes, and when combined with a backing or said capture chip, forms a multi-well chip which comprises a plurality of wells; and wherein said plurality of cell-sized dimples or wells matches one-for-one, and aligns with, said plurality of holes in said multi-well through-hole chip. |
地址 |
Fremont CA US |