发明名称 Moldable adhesive wafers
摘要 Disclosed herein are methods and devices for coupling and securing a medical device appliance. In particular, one piece moldable adhesive structures are disclosed which allow customization of an attachment wafer to the size and shape of, for example, a stoma, while allowing flexibility and security for attaching a medical device, such as an ostomy pouch or other device to the subject.
申请公布号 AU2014293635(A1) 申请公布日期 2016.02.18
申请号 AU20140293635 申请日期 2014.05.23
申请人 CONVATEC TECHNOLOGIES INC. 发明人 JOHNSEN, KENNETH
分类号 A61F13/58;A61F5/44;A61F5/443;A61F5/445;A61F5/448;A61F13/02;A61L24/00 主分类号 A61F13/58
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