| 发明名称 |
ASSEMBLY FOR HANDLING A SEMICONDUCTOR DIE AND METHOD OF HANDLING A SEMICONDUCTOR DIE |
| 摘要 |
In various embodiments, an assembly for handling a semiconductor die is provided. The assembly may include a carrier with a surface. The assembly may also include an adhesive tape fixed to the surface of the carrier. The adhesive tape may be configured to adhere to the semiconductor die. The adhesive tape may include adhesive, the adhesion of which can be reduced by means of electromagnetic waves. The assembly may further include an electromagnetic source configured to apply electromagnetic waves to the adhesive tape to reduce adhesion of the adhesive tape to the semiconductor die. The assembly may additionally include a die pick-up component configured to pick up the semiconductor die from the adhesive tape. |
| 申请公布号 |
US2016049325(A1) |
申请公布日期 |
2016.02.18 |
| 申请号 |
US201514826223 |
申请日期 |
2015.08.14 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
PARAMIO JOVES Ronald;KUNAMANI Thanabal Ganesh;LEE Kuang Ming;OLIVEROS SUMAGPOA Avelino;TAN Kian Heong;VERGARA BICOMONG Nestor;KRISHNAN Jagen;TONG Soon Hock |
| 分类号 |
H01L21/683;B32B37/00;B32B43/00;B25J11/00;H01L21/67 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An assembly for handling a semiconductor die, the assembly comprising:
a carrier with a surface; an adhesive tape fixed to the surface of the carrier, wherein the adhesive tape is configured to adhere to the semiconductor die, wherein the adhesive tape comprises adhesive, the adhesion of which can be reduced by means of electromagnetic waves; an electromagnetic source configured to apply electromagnetic waves to the adhesive tape to reduce adhesion of the adhesive tape to the semiconductor die; and a die pick-up component configured to pick up the semiconductor die from the adhesive tape. |
| 地址 |
Neubiberg DE |
