INTEGRATED DEVICE COMPRISING A HEAT-DISSIPATION LAYER PROVIDING AN ELECTRICAL PATH FOR A GROUND SIGNAL

摘要

Provided herein is an integrated device that includes a substrate, a die, a heat-dissipation layer located between the substrate and the die, and a first interconnect configured to couple the die to the heat-dissipation layer. The heat-dissipation layer may be configured to provide an electrical path for a ground signal. The first interconnect may be further configured to conduct heat from the die to the heat-dissipation layer. The integrated device may also include a second interconnect configured to couple the die to the substrate. The second interconnect may be further configured to conduct a power signal between the die and the substrate. The integrated device may also include a dielectric layer located between the heat-dissipation layer and the substrate, and a solder-resist layer located between the die and the heat-dissipation layer.

主权项

1. An integrated device comprising:
a substrate; a die; a heat-dissipation layer disposed on a surface of the substrate and located between the substrate and the die; a first interconnect configured to couple the die to the heat-dissipation layer, wherein the heat-dissipation layer is configured to provide an electrical path for a ground signal and the heat-dissipation layer is adjacent to the first interconnect; and a second interconnect configured to couple the die to the substrate, wherein the second interconnect is electrically isolated from the heat-dissipation layer by a solder-resist layer.