| 摘要 |
The invention concerns silica microspheres (M) having an outer diameter between 50 and 125 μm, preferably between 60 and 90 μm, a wall thickness not less than 1 μm, preferably between 1 and 3 μm and a density between 0.3 and 0.7/cm3, a manufacturing method by injecting silica microsphere precursors (MS, PR1, PR1′, PR2′) into an inductive plasma (P), assembly methods and possible uses of silica microspheres. |
