| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive for a semiconductor, which is excellent in adhesiveness to a metal material, can improve reliability of a bonded body, and can be used for a long period of time. <P>SOLUTION: The adhesive for the semiconductor comprises: an epoxy compound; a disulfide compound; an acid anhydride-based curing agent; and an imidazole curing accelerator. <P>COPYRIGHT: (C)2012,JPO&INPIT |
