发明名称 半導体装置及びその製造方法
摘要 According to one embodiment, a semiconductor device of a junctionless structure includes a semiconductor layer of a first conductivity type. A pair of source/drain electrodes at a distance is on the semiconductor layer. A gate insulating film is on the semiconductor layer between the source/drain electrodes. A gate electrode is on the gate insulating film. The semiconductor layer has two or more kinds of impurities. One kind of the two or more kinds of impurities is an element selected from a group of chalcogens, and another kind of the two or more kinds of impurities is a first conductivity type impurity.
申请公布号 JP5865751(B2) 申请公布日期 2016.02.17
申请号 JP20120071409 申请日期 2012.03.27
申请人 株式会社東芝 发明人 小池 正浩;上牟田 雄一;手塚 勉
分类号 H01L21/336;H01L21/8247;H01L27/115;H01L29/78;H01L29/788;H01L29/792 主分类号 H01L21/336
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