| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper foil, a copper-clad laminate, a flexible circuit board, and a manufacturing method for the copper-clad laminate, which, even if wiring is formed on the flexible circuit board, show outstanding durability under harsh usage conditions including repeated flexing with a small curvature radius. <P>SOLUTION: The copper foil contains 0.001 to 0.4 mass% Mn, inevitable impurities, and the balance being Cu. A preferred orientation region, where a fundamental crystal axis <100> of the unit lattice of the copper has an orientation difference of within 15° relative to two orthogonal axes respectively, one of which is in the thickness direction of the copper foil and the other of which is in a certain direction present in the foil surface, accounts for 60% or more by an area ratio. There are provided the copper-clad laminate and a flexible circuit board, which use the copper foil, and also provided a method for manufacturing the copper-clad laminate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
