发明名称 化合物半導体装置及びその製造方法
摘要 <P>PROBLEM TO BE SOLVED: To provide a compound semiconductor device that can improve the operating efficiency while maintaining pinch-off characteristics and to provide a method of manufacturing the same. <P>SOLUTION: A compound semiconductor device comprises: a substrate 11; an electron transit layer 12 that is provided on the substrate 11; an electron supply layer 13 that is provided on the electron transit layer 12; a source electrode 15s and a drain electrode 15d that are provided on the electron supply layer 13; and a first gate electrode 15g-1 and a second gate electrode 15g-2 that are provided between the source electrode 15s and the drain electrode 15d, above the electron supply layer 13. The work function of the first gate electrode 15g-1 is lower than that of the second gate electrode 15g-2. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5866782(B2) 申请公布日期 2016.02.17
申请号 JP20110066273 申请日期 2011.03.24
申请人 富士通株式会社 发明人 西森 理人;今田 忠紘
分类号 H01L21/338;H01L21/28;H01L21/336;H01L21/337;H01L29/41;H01L29/778;H01L29/78;H01L29/808;H01L29/812 主分类号 H01L21/338
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