发明名称 |
LOW PROFILE, SPACE EFFICIENT CIRCUIT SHIELDS |
摘要 |
A low profile, space efficient circuit shield is disclosed. The shield includes top and bottom metal layers disposed on the top of and below an integrated circuit. In one embodiment the shield can include edge plating arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In another embodiment, the shield can include through vias arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In yet another embodiment, passive components can be disposed adjacent to the integrated circuit within the shield. |
申请公布号 |
EP2817820(A4) |
申请公布日期 |
2016.02.17 |
申请号 |
EP20130751497 |
申请日期 |
2013.02.21 |
申请人 |
APPLE INC. |
发明人 |
ARNOLD, SHAWN X.;MULLINS, SCOTT P.;THOMA, JEFFREY M.;CHANDHRASEKHAR, RAM |
分类号 |
H01L21/60;H01L23/31;H01L23/552;H05K3/34;H05K9/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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