发明名称 ETCHING METHOD OF MULTILAYERED FILM
摘要 It is required that the deterioration of the verticality of a spacer formed in a multilayered film in part of an object is prevented. A method of etching a multilayered film includes a process of etching the multilayered film by generating plasma in the process chamber of a plasma process apparatus. In the process, a first process gas which includes hydrogen gas, hydrogen bromide gas, fluorine containing gas, hydrocarbon gas, fluorine hydrocarbon gas and fluorine carbon gas, is supplied from a first supply part for supplying a gas to the center region of the object and a second supply part for supplying a gas to the outside region of a corresponding center region. A second process gas which includes hydrocarbon gas and fluorocarbon gas, is supplied from one of the first supply part and the second supply part. The first process gas and the second process gas are excited.
申请公布号 KR20160018367(A) 申请公布日期 2016.02.17
申请号 KR20150106597 申请日期 2015.07.28
申请人 TOKYO ELECTRON LIMITED 发明人 ISHITA RYUUU;SAITO YUSUKE
分类号 H01L21/3213;H01L21/3065;H01L21/311;H01L27/115 主分类号 H01L21/3213
代理机构 代理人
主权项
地址