发明名称 LASER CUTTING APPARATUS AND CUTTING METHOD THEREFOR
摘要 Provided is a laser cutting device and method which changes a cutting speed of a laser according to a difference between characteristics (absorption coefficients) of an object to be cut, so as to uniformly supply an energy of laser to the whole of the object, thereby preventing the object from being incompletely cut. A laser cutting device includes a database that stores information about a cutting pattern, a moving part that changes a location of a laser beam emitted to an object to be cut, a characteristic value input part that receives speed information from a user according to locations on the cutting pattern, and a control part that adjusts a moving speed of the laser beam by controlling the moving part according to the speed information from the characteristic value input part, and the information about the cutting pattern from the data base.
申请公布号 EP2883648(A4) 申请公布日期 2016.02.17
申请号 EP20140806156 申请日期 2014.07.31
申请人 LG CHEM, LTD. 发明人 BAN, JIN HO;AHN, CHANG BUM;MIN, KI HONG;PARK, JI WON;KO, MYUNG HOON;NA, SEUNG HO
分类号 B23K26/38;B23K26/00;B23K26/08;B23K26/10;B23K26/40 主分类号 B23K26/38
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