WAFER LEVEL FAN-OUT PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a multi-chip module type wafer level fan-out package with a new structure in which a first semiconductor chip and a second semiconductor chip of a multi-chip are molded and a bumping process for forming rewiring is performed to manufacture a package and only a connection portion between the first semiconductor chip and the second semiconductor chip, constituting a fine line space is connected by a conductive wire, and a manufacturing method thereof. The present invention is to provide a multi-chip module type wafer level fan-out package with a new structure, in which a first semiconductor chip and a second semiconductor chip of a multi-chip are molded and a bumping process of arranging rewiring, which is conductively connected to bonding pads of the first semiconductor chip and the second semiconductor chip, on an outer area of each chip is performed to manufacture a wafer level package, wherein only the electrical connection portion between the first semiconductor chip and the second semiconductor chip constituting a fine line space is connected by a conductive wire before or after forming the rewiring, and a manufacturing method thereof.