METHOD AND APPARATUS FOR COOLING SEMICONDUCTOR WAFER

摘要

A heated semiconductor wafer is mounted on a heated holding table. The heated semiconductor wafer is cooled while insulating the semiconductor wafer from the upper part of the holding table. In the cooling process, the semiconductor wafer is cooled while adjusting the temperature of the semiconductor wafer cooled by radiation heat from the holding table, and the speed and a cooling time of lowering the temperature of the semiconductor wafer.