| 摘要 |
Disclosed are a tin-based electroplating solution containing a fluorine-based surfactant for manufacturing a solder bump of a flip chip package, and a solder bump manufacturing method using the same. According to the present invention, the tin-based electroplating solution comprises methanesulphonic tin, methanesulphonic silver, methanesulphonic acid, a fluorine-based surfactant, aromatic polyoxyalkylene-based ether, and water. The solder bump manufacturing method comprises: (1) a step of forming a copper or a copper/nickel pillar bump on a metal base layer (under bump metallurgy) of a silicon wafer having a protective layer with an opened electrode pad and the metal base layer using a copper or a nickel electroplating solution; and (2) a step of using the tin-based electroplating solution to form a solder bump. |
