| 摘要 |
According to the present invention, horizontal positions of joined substrates are appropriately adjusted to appropriately perform a joining process of the substrates. A joining apparatus (41) comprises: an upper chuck (140) which vacuum-exhausts an upper wafer W_U on a lower face thereof to absorb and hold the upper wafer W_U; and a lower chuck (141) which is installed under the upper chuck (140), and vacuum-exhausts a lower wafer W_L on an upper face thereof to absorb and hold the lower wafer W_L. The lower chuck (141) includes a body portion (190) which vacuum-exhausts the lower wafer W_L, and multiple pins (191) which are installed on the body portion (190) and come in contact with a rear face of the lower wafer W_L. A tip position of a pin (191a) installed at the center of the body portion (190) is higher than tip positions of pins (191b) installed at an outer circumferential portion of the body portion (190). |
