METHOD OF BONDING SUBSTRATES

摘要

The present invention relates to a substrate bonding method. More specifically, the method can prevent screen defects caused by the substrate being bent when used by coating and curing an adhesive after heating the substrate. According to an embodiment of the present invention, the substrate bonding method is used to bond a first sensitivity substrate and a second sensitivity substrate which can be bent by heat. The method includes the steps of: providing the first sensitivity substrate at a first temperature; heating the first sensitivity substrate up to a second temperature higher than the first temperature; coating an adhesive onto the surface of the first sensitivity substrate; curing the adhesive; cooling the first sensitivity substrate and the adhesive down to a third temperature lower than the second temperature; and attaching the second sensitivity substrate onto the first sensitivity substrate through using the adhesive. The second temperature is set based on a temperature a product including the bonded substrates is used at.