| 摘要 |
The invention provides a primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device, includes (A) silazane compound or polysilazane compounds that has one or more silazane bonds in the molecule, (B) acrylic resin containing either one or both of acrylate ester and methacrylate ester that contains one or more SiH groups in the molecule, and (C) solvent. There can be provided a primer composition in which the adhesion between a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device can be improved, the corrosion of a metal electrode on the substrate can be prevented, and the heat resistance and flexibility of a primer can be improved. |
