发明名称 エピタキシャルウェハの製造装置及び製造方法
摘要 Provided is an epitaxial wafer manufacturing device (1) that deposits and grows epitaxial layers on the surfaces of wafers W while supplying a raw material gas to a chamber, wherein a shield (12), arranged in close proximity to the lower surface of a top plate (3) so as to prevent deposits from being deposited on the lower surface of the top plate (3), is removably attached inside the chamber, has an opening (13) in the central portion thereof that forces a gas inlet (9) to face the inside of a reaction space K, and has a structure in which it is concentrically divided into a plurality of ring plates (16), (17) and (18) around the opening (13).
申请公布号 JP5865625(B2) 申请公布日期 2016.02.17
申请号 JP20110171635 申请日期 2011.08.05
申请人 昭和電工株式会社 发明人 影島 慶明;野口 智之;武藤 大祐;百瀬 賢治
分类号 H01L21/205;C23C16/42;C23C16/44;C23C16/46;C30B25/08;C30B29/36 主分类号 H01L21/205
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