发明名称 Semiconductor mounting
摘要 921,251. Semi-conductor devices. PACIFIC SEMICONDUCTORS Inc. Feb. 2, 1961 [March 7, 1960], No. 3991/61. Class 37. A heat-dissipating mounting assembly for a semi-conductor device, such as a transistor 11, comprises heat-conductive housing 12 having an axial bore in which the device is seated, means such as fins 45 on the periphery of the housing to provide a heat-radiating surface, and a releasable retaining member of conductive material in close-fitting engagement with the housing pressing the device into firmly seated relation with the housing; as shown, a threaded tubular member 13 bearing on flange 23 of the device. The leads 24 of the device extend through a hole or, as shown, individual passages 36 in the bottom of the housing, being insulated therefrom by sleeves 37. The housing is bolted to a chassis or heat sink 25. The retaining member may alternatively be a threaded cap bearing on the top of the semi-conductor device, or a snapring device.
申请公布号 GB921251(A) 申请公布日期 1963.03.20
申请号 GB19610003991 申请日期 1961.02.02
申请人 PACIFIC SEMICONDUCTORS, INC. 发明人
分类号 H01L23/40 主分类号 H01L23/40
代理机构 代理人
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