| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing sheet with a protective film forming layer which has high uniformity in thickness, can easily produce a semiconductor chip having a protective film with good print accuracy, and has a heat resistance property. <P>SOLUTION: A dicing sheet comprises a protective film forming layer 4 on an adhesive layer of an adhesive sheet 3 consisting of a base film 1 and the adhesive layer 2, the protective film forming layer is formed on an inner perimeter of the adhesive sheet, and the adhesive layer is exposed to an outer perimeter of the adhesive sheet. The melting point of the base film exceeds 130°C or the base film does not have the melting point, and the thermal shrinkage of the base film heated at 130°C and for 2 hours, is -1 to +1%. <P>COPYRIGHT: (C)2013,JPO&INPIT |
