发明名称 化合物半導体装置及びその製造方法
摘要 A compound semiconductor device includes: a compound semiconductor multilayer structure; a gate insulating film on the compound semiconductor multilayer structure; and a gate electrode, wherein the gate electrode includes a gate base portion on the gate insulating film and a gate umbrella portion, and a surface of the gate umbrella portion includes a Schottky contact with the compound semiconductor multilayer structure.
申请公布号 JP5866766(B2) 申请公布日期 2016.02.17
申请号 JP20110027670 申请日期 2011.02.10
申请人 富士通株式会社 发明人 倉橋 菜緒子
分类号 H01L21/338;H01L21/336;H01L29/778;H01L29/78;H01L29/812 主分类号 H01L21/338
代理机构 代理人
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