| 摘要 |
There is provided an opto-electric hybrid board in which a metal reinforcement layer is in intimate contact with an insulative layer of a flexible circuit board without an adhesive layer interposed therebetween, the metal reinforcement layer allowing the proper mounting of an element while deformation due to pressing load applied during the mounting is suppressed. In the opto-electric hybrid board, a flexible double-sided circuit board E in which electrical interconnect lines 2A and 2B are formed on the front and back surfaces of an insulative layer 1 having flexibility is used as an electric circuit board. A metal reinforcement layer M is formed by plating on at least part of the electrical interconnect line 2B on the back surface side which corresponds to a mounting pad 2a on the front surface side. An optical waveguide W is formed in contact with the electrical interconnect line 2B on the back surface side of the flexible double-sided circuit board E. |
