| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device which can minimize variation in amount of a translucent resin filled in a recess of a housing part; prevent, when a surplus translucent resin adheres to an external lateral face of the housing part, adherence of a foreign material to the surplus translucent resin; and prevent adherence of products (semiconductor light-emitting devices) to each other. <P>SOLUTION: A housing part 5 includes an exhaust port 9 for exhausting a surplus of a translucent resin filled in a recess 6. When parts 1a, 2a of a lead frame, which project to the outside of the housing part 5 are folded, the parts 1a, 2a sheathe the groove-shaped exhaust port 9 of the housing part 5 and regions where the surplus translucent resin is likely to adhere on an external lateral face of the housing part 5. <P>COPYRIGHT: (C)2013,JPO&INPIT |
