An image sensor according to the embodiment of the present invention includes a substrate; a photoelectric conversion device which is arranged in the substrate; a first storage region which is separated from the photoelectric conversion device in the substrate; a gate which is arranged on the first storage region; a light shield layer which covers the gate; a dielectric layer which is interposed between the gate and the light shield layer, and is extended from the upper surface of the substrate; an interlayer dielectric structure which covers the light shield layer on the substrate; and a microlens which is located to be overlapped with the photoelectric conversion device on the interlayer dielectric structure. A sidewall of the light shield layer adjacent to a sidewall of the gate has a first thickness vertically extended from the upper surface of the dielectric layer. The first thickness of the light shield layer is thicker than a second thickness of the light shield layer located on the gate.
申请公布号
KR20160017686(A)
申请公布日期
2016.02.17
申请号
KR20140098251
申请日期
2014.07.31
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
NOH, HYUN PIL;LEE, DONG CHUL;LEE, SEOK HA;PARK, CHAN;SHIN, SEUNG HO