| 摘要 |
Electronic device fins may be formed by epitaxially growing a first layer of material on a substrate surface at a bottom of a trench formed between sidewalls of shallow trench isolation (STl) regions. The trench height may be at least 1.5 times its width, and the first layer may fill less than the trench height. Then a second layer of material may be epitaxially grown on the first layer in the trench and over top surfaces of the STl regions. The second layer may have a second width extending over the trench and over portions of top surfaces of the STl regions. The second layer may then be patterned and etched to form a pair of electronic device fins over portions of the top surfaces of the STl regions, proximate to the trench. This process may avoid crystaline defects in the fins due to lattice mismatch in the layer interfaces. |
