发明名称 金めっき層を有するステンレス基板
摘要 The process of forming a partial gold-plating pattern on a stainless substrate includes a first plating step, a second plating step, and a stripping step. In the first plating step, pretreatment is applied to a stainless substrate including opposite main planes and a processing site formed of a plane different from the main planes, after which a first gold-plating layer is formed all over the surface of the stainless substrate using a hydrochloric acid plating solution. In the second plating step, mask plating is used to form a second gold-plating layer on the first gold-plating layer that covers the processing site in a desired pattern, and in the stripping step, a portion of the first gold-plating layer in an area where there is none of the second gold-plating layer is stripped off using an alkaline stripping solution.
申请公布号 JP5861652(B2) 申请公布日期 2016.02.16
申请号 JP20130020325 申请日期 2013.02.05
申请人 大日本印刷株式会社 发明人 永田 昌博
分类号 C25D5/10;C25D5/02;C25D5/26;G11B21/21;H01M8/0202 主分类号 C25D5/10
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