发明名称 基材の処理方法、半導体装置および仮固定用組成物
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate treatment method which can excellently prevent a substrate from being broken during peeling off of the substrate, that is, which is excellent in yield. <P>SOLUTION: A substrate treatment method includes, in this order, the steps of: (1) obtaining a laminate by provisionally fixing the substrate onto a support via a provisional fixation material containing a cycloolefin polymer (A) and an ultraviolet absorber (B); (2) processing the substrate and/or moving the laminate; (3) irradiating the provisional fixation material with ultraviolet rays from the support side; and (4) peeling off the substrate from the support. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5861304(B2) 申请公布日期 2016.02.16
申请号 JP20110168479 申请日期 2011.08.01
申请人 JSR株式会社 发明人 高橋 誠一郎;藤山 等;後藤 宏文
分类号 H01L21/02;H01L21/304 主分类号 H01L21/02
代理机构 代理人
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