| 摘要 |
The invention relates to a method for the testing of circuit boards using a testing apparatus which has a test set-up for contacting the circuit board test points of a circuit board to be tested. The test set-up has test contact elements in a predetermined regular grid. The method involves the following steps: a) the test set-up is pressed on to the circuit board to be tested in a first testing position relative to the circuit board to be tested, so that several circuit board test points are in contact with at least one test contact element b) measurement of several conductor paths for breaks and/or short-circuits by means of continuity measurements c) movement of the test set-up relative to the circuit board to be tested into another testing position in which at least one circuit board test point of a conductor path is in contact with at least one test contact element, which has not previously been measured fully for breaks and/or short-circuits d) measurement of further conductor paths for breaks and/or short-circuits by means of continuity measurements e) repetition of steps c) and d) until at least the majority of conductor paths of the circuit board to be tested have been measured, wherein a test set-up is used which has test contact elements arranged with a density of at least 100 contact points per square centimetre. |
