| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-frequency bonding device, for low-frequency bonding at a normal temperature, of a metal bump to an electrode terminal of an electronic substrate and an electronic component.SOLUTION: The low-frequency bonding device includes a motor which generates a low-frequency by rotating a rotor shaft, an eccentric component which generates cyclic motion by engaging with a rotor shaft core so as to decenter the rotor shaft core, a radial ball bearing which rotates under such condition as the outer periphery of the eccentric component is inserted in an inner ring, and an XY stage for guiding the cyclic motion. The cyclic motion is so performed as to cause the center of the metal bump to draw a circle, and a motor starts at a low speed. The speed is gradually raised to transit from a middle speed to a high speed. An amplitude becomes minimum in a high speed range, so that low-frequency bonding is made in truncated cone at a junction part. A contaminant is discharged and coplanarity is assured, for good junction between the metal bumps and all electrode terminals. |
