发明名称 積層体とその製造方法及びそれを用いたデバイス構造体の製造方法
摘要 <P>PROBLEM TO BE SOLVED: To provide a laminate formed of a polyimide film and a support used as a base material for laminating various devices, configured to prevent the laminate from being separated even in a high temperature process in manufacturing the device and to allow easy separation of the polyimide film from the support after producing the device on the polyimide film. <P>SOLUTION: A film, as a polyimide film 6, has a surface which is opposite at least the support 1 and plasma-treated. A patterning process of forming an easy-to-bond part and an easy-to-separate part which are different in adhesive/separation strength and almost the same in surface roughness is performed on at least one of facing surfaces of the support 1 and the polyimide film 6 using a coupling agent, and thereafter the support and the polyimide film are superimposed and pressed and heated. The polyimide film 6 is obtained by reaction between a diamine which mainly contains an aromatic diamine at least 70 mol% of which has a benzoxazole structure and a tetracarboxylic acid. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5862238(B2) 申请公布日期 2016.02.16
申请号 JP20110260537 申请日期 2011.11.29
申请人 東洋紡株式会社 发明人 奥山 哲雄;應矢 量之;土屋 俊之;前田 郷司
分类号 B32B27/34;B32B7/04;H01L21/336;H01L29/786 主分类号 B32B27/34
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