发明名称 |
Selective etching in the formation of epitaxy regions in MOS devices |
摘要 |
A method for forming a semiconductor structure includes forming a gate stack over a semiconductor substrate; forming a recess in the semiconductor substrate and adjacent the gate stack; and performing a selective epitaxial growth to grow a semiconductor material in the recess to form an epitaxy region. After the step of performing the selective epitaxial growth, a selective etch-back is performed to the epitaxy region. The selective etch-back is performed using process gases comprising a first gas for growing the semiconductor material, and a second gas for etching the epitaxy region. |
申请公布号 |
US9263339(B2) |
申请公布日期 |
2016.02.16 |
申请号 |
US201012784344 |
申请日期 |
2010.05.20 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Cheng Yu-Hung;Li Chii-Horng;Lee Tze-Liang |
分类号 |
H01L21/336;H01L21/8234;H01L21/3065;H01L27/11;H01L29/78;H01L21/02 |
主分类号 |
H01L21/336 |
代理机构 |
Slater & Matsil, L.L.P. |
代理人 |
Slater & Matsil, L.L.P. |
主权项 |
1. A method for forming a semiconductor structure, the method comprising:
forming a gate stack over a semiconductor substrate, the semiconductor substrate having a first lattice constant; forming a recess in the semiconductor substrate and adjacent the gate stack; performing a first selective epitaxial growth to grow a first semiconductor material in the recess and adjoining a bottom-most surface of the recess, the first selective epitaxial growth substantially only growing the first semiconductor material from one or more crystalline surface, the bottom-most surface of the recess comprising a surface of the semiconductor substrate, the first semiconductor material having a second lattice constant; after the step of performing the first selective epitaxial growth, performing a selective etch-back on the first semiconductor material, wherein the selective etch-back is performed using process gases comprising a first gas for growing the first semiconductor material, and a second gas for etching the first semiconductor material, wherein after the selective etch-back is performed at least a portion of a top surface of the first semiconductor material is at or above a top surface of the semiconductor substrate; and performing a second selective epitaxial growth to grow a second semiconductor material adjoining the first semiconductor material to form a cap region, the second selective epitaxial growth substantially only growing the second semiconductor material from one or more crystalline surface, the second semiconductor material having a third lattice constant, a magnitude of a difference between the first lattice constant and the second lattice constant being greater than a magnitude of a difference between the first lattice constant and the third lattice constant. |
地址 |
Hsin-Chu TW |