发明名称 Wire constructs
摘要 A method for forming a wire construct includes forming a groove in a polymer having a mouth that is narrower than a width of a deeper portion of the groove and placing a substantial length of wire in the groove, the wire having a larger cross-sectional dimension than the mouth of the groove. Encapsulant is placed over the polymer. The wire construct is to be used for implantable stimulation leads, such as a cochlear stimulation lead or a neurostimulation lead. Two wire constructs can be assembled to form a multilayer wire construct.
申请公布号 US9263172(B2) 申请公布日期 2016.02.16
申请号 US201213985237 申请日期 2012.02.16
申请人 ADVANCED BIONICS AG 发明人 Lotfi Atoosa
分类号 H01B7/00;H01B7/04;A61N1/05;B23K26/08;B23K26/20;B23K26/36;B23K26/40;B29C47/00;B29C47/88;B29C37/00;B29K83/00;H01B13/00 主分类号 H01B7/00
代理机构 代理人 Vancott Fabian;Nichols Steven L.
主权项 1. A method for forming a wire construct comprising: providing a polymer; in the polymer, forming a groove having a mouth that is narrower than a width of a deeper portion of the groove; placing a substantial length of a wire in the groove, the wire having a larger cross-sectional dimension than the mouth of the groove; and depositing an encapsulant over the polymer.
地址 Staefa CH